Electroplating has become an important processing method in MEMS technology. Compared with surface treatment in the traditional sense, industries electroplating in MEMS technology is mainly used to fabricate microstructures. This article introduces several common MEMS technologies with electroplating as the core process and their application fields, which include LIGA/UV-LIGA, EFAB, PolyStrata, TSV/TGV, MetalMUMPs, etc. In combination with other well-designed micro-process technologies such as photolithography, coating, and etching, the complex three-dimensional metal MEMS microstructure with the characteristics of ultra-high aspect ratio, multi-layer stacking, suspended and movable can be fabricated. For different application requirements, the typical functional applications can be realized, such as micromechanical structure, inertial sensor, RF device, heterogeneous integration and heat dissipation, which have a wide range of practical significance.