基于硅基MEMS三维集成技术的片式多波束发射前端
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中国电子科技集团公司第十三研究所

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TN454

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Multi-beam transmitting front-end based on the MEMS 3D integrated technology
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The 13th Research Institute, China Electronic Technology Corporation

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    摘要:

    基于多波束发射前端的相控阵,具有波束灵活扫描和多目标同时通信的能力,是低轨互联网通信卫星的重要微波子系统。采用硅基MEMS三维异构集成技术,将多个微波单片集成电路MMIC(Monolithic Microwave Integrated Circuit)和硅基MEMS功分交叉网络等无源结构一体化集成,实现了一种K频段8波束32通道瓦片式相控阵发射前端。该器件由五个硅基封装模块堆叠而成,不同封装模块之间通过植球(金球凸点及铅锡焊球)的方式互连,内部通过TSV通孔技术实现垂直互连。为展示其性能,制备了19 GHz~21 GHz频段的样件,尺寸为16.25 mm×14.25 mm×6.3 mm。经测试,单通道发射增益≥18 dB,输入输出端口驻波≤2.0,同时具备6位数控移相和5位数控衰减功能。

    Abstract:

    The multi-beam transmitting front-end proposed by phased-array mode is an important sub-system of low-orbit internet communication satellite due to its characteristics of flexible beam scanning and simultaneous communication of multi-targets. In this paper, several microwave monolithic integrated circuits (MMIC) and the passive structures, such as MEMS power divider crossover network, are integrated by using the silicon-based three-dimensional(3D) heterogeneous integration technology. A component of K-band 8 beam 32 channels tile transmitting array based on the MEMS technology is designed. The component consists of five layers of silicon module, and the different silicon modules are connected to each other with solder balls(including the golden ball and the SnPb ball). And the RF signal inside the silicon-based module is transmitted by the through silicon vias (TSV). The dimension of the component is about 16.25 mm×14.25 mm×6.3 mm. The test result shows that, in the range of 19 GHz~21 GHz, the transmit gain of each channel ≥18 dB, and the input and output VSWRs ≤2.0. The component also has the functions of 6 bit phase shift and 5 bit attenuation.

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赵宇,赵玛利,赵永志,张梦娇,王佳,李美苓,吴洪江.基于硅基MEMS三维集成技术的片式多波束发射前端[J].遥测遥控,2021,42(5):85-94.

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  • 收稿日期:2021-05-25
  • 最后修改日期:2021-09-14
  • 录用日期:2021-09-02
  • 在线发布日期: 2021-09-24
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  • 优先出版日期: 2021-09-24