In order to meet the small size and light weight requirements of aerospace systems for high-speed and broadband data and image transmission products, this paper has developed an high-speed and high-density integration technology for optical transmission. The substrate adopts symmetrical strip difference line design, and laminated assembly to provide integration density and reduce volume. The high-speed signal integrity is analyzed through modeling and simulation. The optical device is innovatively designed on the bottom of the housing to achieve an efficient heat dissipation structure while improving the reliability of the optical device. By hybrid integrated micro-assembly technology , silicon interposer achieves chip-level three-dimension integration, and by multiple packaging technology,the problem of optical fiber coupling and sealing synchronization is also solved with the volume of the manufactured micro system module≤ 27 mm× 24 mm×5 mm, and the leak rate of the sealed package ≤ 5×10–9Pa.m3/s.