With the development of highly integrated RF MEMS devices, there are more and more researches on 3D (Three Dimensional) integration technology. The 3D multi-layer stacking coaxial devices based on PolyStrata technology stand out for its advantages of dispersionless, low loss and ultra-wiband. PolyStrata technology uses ultraviolet thick adhesive as sacrificial material, which has high requirements on photoresist adhesion, precision, process compatibility and release performance, and conventional thick adhesive is difficult to achieve. In this paper, two kinds of UV lithography thick adhesives, A and B, are explored, and their process parameters and graphic quality are compared. The experimental results show that the thickness uniformity of photoresist A is 98.6%, and the graphic deviation is less than 10 μm. The deviation of photoresist B is less than 5 μm, but with poor uniformity, about 80.4%.