In order to meet the urgent need of three dimensional integrated structure of microwave circuit, the research of wideband high integrated multilevel RF interconnection technology is carried out. This paper mainly designs two kinds of circuit structures, multilevel horizontal interconnection design and multilevel vertical interconnection design. In the circuit of multilevel horizontal interconnection, by optimizing the horizontal transition between coaxial and microstrip lines and the chamfered transition mode, the simulation results show that the return loss is better than 21dB, and the insertion loss is better than 0.16dB within the DC~30GHz. In the multilevel vertical interconnection circuit, by optimizing the structure of BGA interplate interconnection, the simulation results show that the signal return loss is better than 13dB and the insertion loss is better than 0.57dB within the DC~30GHz. In the demand of miniaturization and high integration multilevel RF interconnection technology is the key path to solve the problem of wideband RF signal transmission. It can be widely used in the three dimensional integrated structure of microwave circuits and has great application prospect.