Through hardware framework design, TSV key process design, CPS simulation design, full-process testing and reliability research based on TSV, the space-borne micro system finally integrates massive amounts of anti-irradiation information in the nationally produced HTCC shells. The processor, anti-irradiation large-capacity memory, anti-irradiation microcontroller, anti-irradiation 38 decoder and other devices form a 43 mm×43 mm×5.65 mm airtight encapsulated spaceborne micro system. This micro-system product has high-reliability, high-performance processing capabilities and common on-board control and communication interfaces. It can be used for real-time processing of on-board load information and control and management of the on-board platform. It can effectively replace existing board-level products to achieve on-board miniaturization and integration of electronic systems.